产品规格书/Specification
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产品/product: |
微晶玻璃发热电阻浆料/ ceramic glass board heating Resist paste |
|
料号/Part number: |
05H09 |
适用范围/Application:
此产品适用于微晶玻璃加热电路使用。
The resist paste applies to ceramic glass heating resistor paste.
使用条件/Operating conditions：
|
基材 Substrate |
微晶玻璃 Glass ceramic |
|
印刷 Printing |
200-250目丝网印刷 200-250 mesh stainless screen |
|
流平 Levelling |
室温下流平5-15分钟（时间根据流平的实际情况决定）。 5-15min minutes at room temperature |
|
干燥 Drying |
通风烘箱烘烤100-150℃，10-15分钟 （烘考温度低于300℃，可根据烘烤的实际情况决定烘烤时间。） 100-150℃ 10-15 min |
|
烧结 Firing Condition |
隧道炉空气气氛下烧结，峰值800℃（推荐值），10分钟。 Atmospheric firing in belt furnace with peak time of 10 Minutes at 800℃ |
|
Thinner |
ST1001 |
性能/Characteristics：
1. 浆料性能/Paste Characteristics：
|
性能Characteristic |
标准Standard |
测试方法及条件 Test method and conditions |
|
|
1 |
Fineness |
≤8μm |
FOG test |
|
2 |
Viscosity |
120-280Pa.s |
Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm, 25±1℃， Brookfield HBT（博利飞）粘度计， 转子SC4-14/6R), 10rpm, 25±1℃ 粘度可根据用户实际需要调节。 |
2. 烧结后特性/Characteristics after firing：
在1烧结条件下，膜厚8-12mm Check fired film produced under the conditions specified in 1）, (Film thickness is 8-12mm.)
|
特性 Characteristics |
Standard 标准 |
测试方法和条件 Test method and conditions |
|
|
3 |
外观 Appearance |
紧凑，致密 Compact and unknit |
Eyeballing |
|
4 |
方阻值 Resistivity |
如下表格 As below form |
标准膜厚10μm Standard film thickness is 10mm. |
|
温度系数 TCR |
如下表格 As below form |
HTCR 25-125℃ |
|
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产品系列 Product series |
微晶玻璃发热电阻浆料 Ceramic glass board heating Resist paste |
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P/N |
resistivity (Ω/□) |
TCR (ppm/℃) |
烧结温度℃ Sintering |
viscosity (kcps) |
|
05H09-0R01012 |
0.01 |
1200 |
800℃ |
120～280 |
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05H09-0R02012 |
0.02 |
1200 |
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05H09-0R03012 |
0.03 |
1200 |
||
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05H09-0R04012 |
0.04 |
1200 |
||
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05H09-0R05012 |
0.05 |
1200 |
||
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05H09-0R10012 |
0.10 |
1200 |
||
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05H09-0R50012 |
0.50 |
1200 |
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05H09-1R00012 |
1.00 |
1200 |
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05H09-5R00012 |
5.00 |
1200 |
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05H09-0R01030 |
0.01 |
3000 |
800℃ |
120～280 |
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05H09-0R02030 |
0.02 |
3000 |
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05H09-0R03030 |
0.03 |
3000 |
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05H09-0R04030 |
0.04 |
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