产品规格书/Specification
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产品/product: |
导电银浆/ Silver paste |
|
料号/Part number: |
01L-2609S |
适用范围/Application:
单组分导体浆料系列，一种附着力可靠的用来固定芯片的导电银浆。此浆料适合粘贴各类芯片到电路板、玻璃、陶瓷等基材，与基体的匹配性能良好，不流挂，用该浆料制出的电极固化后外观光亮、细腻，结构致密。
Single component conductor paste series, the paste is suitable for pasting various chips into the circuit board, glass, ceramic and other substrates, matching with the substrate is good.
使用条件/Operating conditions：
|
基材 Substrate |
电路，玻璃，陶瓷，金属 Thick film circuit, glass, ceramic, metal. |
|
使用方法 Method of use |
点胶 Dispensing ( by needle cylinder, etc.) |
|
流平 Levelling |
5-10min minutes at room temperature 室温下流平5-10分钟（时间根据流平的实际情况决定）。 |
|
固化 Curing conditions |
通风烘箱烘烤120~150℃，30分钟 (固化温度可以在130-180℃范围内，固化时间可根据实际情况决定) 120-150℃, 30 min ( It could be cured at a temperature between 130 ~ 180°C, but it depends of the thickness and the substrate.) |
|
稀释剂 Thinner |
ST-1001 |
性能/Characteristics：
1. 浆料性能/Paste Characteristics：
|
性能Characteristic |
标准Standard |
测试方法及条件 Test method and conditions |
|
|
1 |
Fineness |
≤15μm |
FOG test |
|
2 |
Viscosity |
120-320Pa.s |
Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm, 25±1℃，
Brookfield HBT（博利飞）粘度计， 转子SC4-14/6R), 10rpm, 25±1℃ 粘度可根据用户实际需要调节。 |
|
3 |
固体含量 Solid content |
70 |
银 Silver |
2. 烧结后特性/Characteristics after curing：
在1烧结条件下，Check fired film produced under the conditions specified in 1）,
|
特性 Characteristics |
Standard 标准 |
测试方法和条件 Test method and conditions |
|
|
4 |
Resistivity 方阻 |
≤30mΩ/□ |
|
|
5 |
硬度 Hardness |
4H |
铅笔硬度 Pencil hardness |
|
6 |
剪切强度 Shear strength |
12Mpa |
|
保存条件，有效期/Storage condition and Term of validity
产品应在5-15℃的环境温度下密封储存，有效期为产品发货之日起六个月。
The product shall be guaranteed for 6 months after shipping date, keep tightly under at 5-15℃
包装方式/Packaging method：
标准包装，1000g/罐, 样品可提供200克小罐包装
Standard package 1000g/can，if you need sample to test, available 200g with small package.
