产品规格书/Specification
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产品/product: |
导电银浆/ Silver paste |
|
料号/Part number: |
01M-0605 series |
适用范围/Application:
This Specification applies to piezoceramic conductive paste.
此产品适用于压电陶瓷类产品电极使用
使用条件/Operating conditions：
|
基材 Substrate |
压电陶瓷，粗糙度3-5u， piezoceramic |
|
印刷 Printing |
200-300目丝网印刷 200-300 mesh stainless screen |
|
流平 Levelling |
5-15min minutes at room temperature 室温下流平5-15分钟（时间根据流平的实际情况决定）。 |
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干燥 Drying |
通风烘箱烘烤100-150℃，10-15分钟 （烘烤温度低于300℃，可根据烘烤的实际情况决定烘烤时间。） 100-150℃ 10-15 min |
|
烧结 Firing Condition |
隧道炉空气气氛下烧结，峰值550-750℃（推荐值），9-11分钟。 Atmospheric firing in belt furnace with peak time of 9-11 Minutes at 550-750℃ |
|
Thinner |
ST-1000 |
性能/Characteristics：
|
|
01M-0605 |
01M-0607 |
|
Fineness细度(um) |
≤5 |
|
|
Viscosity粘度(pa.s) |
120-280 |
|
|
Solid content固含量（%） |
70-75 |
60-65 |
|
Resistivity方阻(mΩ/□) |
≤3 |
≤5 |
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Adhesion附着力(N) |
≥45 |
≥42 |
|
Advantages 优点 |
优异的锡焊性能 Excellent soldering performance |
|
|
标准 Standard |
测试方法及条件 Test method and conditions |
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Fineness |
FOG test |
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Viscosity 粘度 |
Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm, 25±1℃， Brookfield HBT（博利飞）粘度计， 转子SC4-14/6R), 10rpm, 25±1℃ 粘度可根据用户实际需要调节。 |
|
Resistivity 方阻 |
Fired film thickness is 8-12mm.) 烧结膜厚8-12um. Test pattern 0.6mm×60mm 测试图形0.6mm×60mm |
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Adhesion strength 附着力 |
Peel Test: 0.5mmφ Tin plated Cu wire soldered on 2mm×2mm Pad. 0.5mmφ锡浸铜线，焊接面积2mm×2mm Solder: 96.5Sn/0.5Cu Mildly activated flux used. 焊料：96.5Sn/0.5Cu |
保存条件，有效期/Storage condition and Term of validity
产品应在5-25℃的环境温度下密封储存，有效期为产品发货之日起1年。
The product shall be guaranteed for 1 year after shipping date, keep tightly under at 5-25℃
包装方式/Packaging method：
标准包装，1000g/罐, Standard package： 1000g/can，
样品装：200克/罐 Sample package: 200g/can
