赛雅公司简介

银浆
银浆

料号:01H-4406

规格书

 

 

产品规格书/Specification

 

产品/product:

导电银浆/ Silver paste

料号/Part number:

01H-4406

 

 

适用范围/Application:

此产品适用于贴片电阻产品电极使用

Suitable for chip resistorthick film circuit electrode.

 

 

使用条件/Operating conditions

基材

Substrate

氧化铝陶瓷

Alumina ceramic

印刷

Printing

200-300目丝网印刷

200-300 mesh stainless screen

流平

Levelling

5-15min minutes at room temperature

室温下流平5-15分钟(时间根据流平的实际情况决定)。

干燥

Drying

通风烘箱烘烤100-150℃,10-15分钟

(空考温度低于300℃,可根据烘烤的实际情况决定烘烤时间。)

100-150  10-15 min

烧结

Firing Condition

隧道炉空气气氛下烧结,峰值850±10(推荐值),9-11分钟。

(可根据实际需要,烧结范围可在780-850℃内调节,但峰值温度时间必须10分钟。)

Atmospheric firing in belt furnace with peak time of 9-11 Minutes at 850±10

Thinner

ST-1000

 

性能/Characteristics

1. 浆料性能/Paste Characteristics

性能Characteristic

标准Standard

测试方法及条件

Test method and conditions

1

Fineness

8μm

FOG test

2

Viscosity

80-280Pa.s

Brookfield HBT utility cup and spindle (SC4-14/6R), 10rpm, 25±1

 

Brookfield HBT(博利飞)粘度计, 转子SC4-14/6R), 10rpm, 25±1℃

粘度可根据用户实际需要调节。

 

2. 烧结后特性/Characteristics after firing

1烧结条件下,膜厚8-12mm Check fired film produced under the conditions specified in 1, (Film thickness is 8-12mm.)  

 

 

 

特性

Characteristics

Standard

标准

测试方法和条件

Test method and conditions

3

Resistivity

方阻

6mΩ/□

Test pattern 0.6mm×60mm

测试图形0.6mm×60mm

 

4

Adhesion strength

附着力

 

 

 

Peel Test: 0.5mmφ Tin plated Cu wire soldered on  2mm×2mm Pad. 

0.5mmφ锡浸铜线,焊接面积2mm×2mm

Solder: 96.5Sn/0.5Cu Mildly activated flux used.

焊料:96.5Sn/0.5Cu

Initial

初始附着力 

38.2N

 

Ageing

老化附着力

23.8N

Ageing: 150℃×24hrs

老化条件:150℃,24小时

 

 

保存条件,有效期/Storage condition and Term of validity

产品应在5-25℃的环境温度下密封储存,有效期为产品发货之日起1年。

The product shall be guaranteed for 1 year after shipping date, keep tightly under at 5-25

 

包装方式/Packaging method

标准包装,1000g/, 样品可提供200克小罐包装

Standard package 1000g/canif you need sample to test, available 200g with small package.

 

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